Ion Implantation Service

Facilities

Facilities

EXCEED3000AH

  • Ion type : B+, BF2+, P+, As+, In+, Sb+, etc.
  • Dose : 5E10 to 1E17
  • Energy : 5 to 750 keV

CLARIS

  • Ion type : B18Hx+, B10Hx+, C16Hx+, C14Hx+, C7Hx+, P4+, As4+, etc.
  • Dose : 5E10 to 1E17
  • (Acceleration)Energy : 4 to 80 keV

(* Contact us in regard to monomer conversion energy.)

IMPHEAT

  • Ion type : Al+, P+, As+, B+, N+, etc.
  • Dose : 5E10 to 1E17
  • Energy : 5keV ~ 960keV
  • RT~500℃ with hot ESC

Ion Implantation Center Equipment list

No. Equipment Model Maker Wafer size Remarks
1 Parallel ion implanter EXCEED
3000AH
Nissin Ion Equipment Co., Ltd. 12" 300-mm FOUP compatible
2 Parallel ion implanter CLARIS Nissin Ion Equipment Co., Ltd. 12" 300-mm FOUP compatible
3 Parallel ion implanter IMPHEAT Nissin Ion Equipment Co., Ltd. 6" (High-temperature compatible)
No. Equipment Model Maker Wafer size Remarks
4 (High-temperature compatible) Class 1 Takasago Thermal Engineering Co., Ltd.    
No. Equipment Model Maker Wafer size Remarks
5 Furnace Annealing VF2000S Koyo Thermo Systems Co., Ltd. 8",6",5",4",3" Small diameters available
6 Furnace Annealing VF2000S Koyo Thermo Systems Co., Ltd. 6",5",4",3" Small diameters available
No. Equipment Model Maker Wafer size Remarks
7 RTP AST3000 Mattson Thermal Products GmbH 12",8"  
No. Equipment Model Maker Wafer size Remarks
8 Dose monitor TP-630 Therma-Wave Inc. 12",8",6"  
No. Equipment Model Maker Wafer size Remarks
9 Wafer Surface Analysis System SP-1 TBI KLA-Tencor Corporation 12",8" 300-mm FOUP compatible
No. Equipment Model Maker Wafer size Remarks
10 Surface resistivity meter RS-35C KLA-Tencor Corporation 8",6",5",4",3"  
11 Surface resistivity meter RS-100 KLA-Tencor Corporation 12",8"  
No. Equipment Model Maker Wafer size Remarks
9 Wafer transfer device JEL 12",8" 300-mm FOUP compatible

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